عملکرد حرارتی هیت سینک کانال PCB برای لامپ های LED
|کد مقاله||سال انتشار||مقاله انگلیسی||ترجمه فارسی||تعداد کلمات|
|57977||2015||7 صفحه PDF||سفارش دهید||3575 کلمه|
Publisher : Elsevier - Science Direct (الزویر - ساینس دایرکت)
Journal : International Journal of Heat and Mass Transfer, Volume 89, October 2015, Pages 1290–1296
In this study, the thermal performance of the printed circuit board (PCB) as a heat sink for the light-emitting diode (LED) bulb is analyzed. Cooling air is drawn through the bottom inlet of a case and exchanges heat from a vertically aligned PCB acting as a heat sink fin. The air then exits through a top outlet. Cooling performance is improved by arranging parallel PCBs to form a channel. Heat transfer is optimized by balancing cooling airflow rates on external and internal PCB surfaces, thereby reducing thermal resistance by 30% compared to previous designs. Cooling performance according to installation angle is investigated. The orientation effect on this channel design is determined to be 10% less than that of the reference design. Finally, the effect of PCB channel cooling performance on the LED bulb’s life span is analyzed and shown to be 40% longer than that of the existing geometry.