دانلود مقاله ISI انگلیسی شماره 117032
عنوان انگلیسی
High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition
کد مقاله سال انتشار تعداد صفحات مقاله انگلیسی
117032 2017 5 صفحه PDF
منبع

Publisher : Elsevier - Science Direct (الزویر - ساینس دایرکت)

Journal : Microelectronic Engineering, Volume 180, 5 August 2017, Pages 30-34

پیش نمایش مقاله
پیش نمایش مقاله

چکیده انگلیسی

In this paper, the influential factors of the silent and ultrasonic electroplating using 3-mercapto-1-propanesulfonate (MPS), polyethylene glycol (PEG), and Polyethylenimine alkyl salt (PN) on the TSV filling are investigated. The effects of different accelerator concentration, current density and ultrasonic agitation on TSV filling are studied. The accelerative effect of MPS on TSV filling by the copper electrodeposition is studied to find out the optimal condition of the accelerator concentration. Using the plating bath with same additive conditions, the effects of different current densities on the TSV filling under the silent and ultrasonic conditions are investigated. The results show that the quality of TSV filling under ultrasonic electroplating has improved by 23% compared with the silent condition at the same current density.