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A new silicone-based Electrically Conductive Adhesive (ECA) has been developed for the Metal Wrap-Through module technology. The ECA has a Ag filler content below 60% but maintains a conductivity after curing below 1 mOhmcm. It is flexible over a wide range of temperatures, which enables stress-relief and is beneficial for durability. Four-cells mini-modules have been made using the newly developed silicone ECA and show excellent performance and durability. The mini-modules did not degrade after 1000 hours in damp heat conditions, nor after 200 thermal cycles.