پردازش سطح وفور سنسورهای فشار با مقاومت بیش از حد؟

Thermal treated Glass wafers are processed to develop overload protected sensors at the chip level [1,2]. By varying the process environment, the crystal growth in SCHOTT Borofloat 33̈ tested by x-ray crystallography and AFM analysis is reduced [3]. Without additional passivation layers the risk of chemical reactions with the glass wafer is avoided and no process steps for coating and removing are required. The glass wafers surface quality is suitable for anodic bonding.