توسعه یک استراتژی مبتنی بر داده های فرایند برای کنترل موقعیت یو پی اس جدا شده چرخ های سنگزنی در تولید ویفر سیلیکون

Manufacturing technologies in the semiconductor industry put high demands on accuracy, especially for the initial steps of wafering. ID grinding has established itself as a cost-effective manufacturing method for the production of wafers with a diameter of up to 150 mm. Methods for improving the quality parameters of the wafer, resulted in the integration of a magnetic position control for the ID grinding wheel to control its axial position. For this, a new conditioning strategy had to be developed in consideration of tool life of the grinding wheel, process automation and wafer quality.