دانلود مقاله ISI انگلیسی شماره 95669
ترجمه فارسی عنوان مقاله

شبیه سازی حرارتی غیر خطی در سطح سیستم: مدل سازی فشرده و اعتبار سنجی آزمایشی

عنوان انگلیسی
Non-linear thermal simulation at system level: Compact modelling and experimental validation
کد مقاله سال انتشار تعداد صفحات مقاله انگلیسی
95669 2018 7 صفحه PDF
منبع

Publisher : Elsevier - Science Direct (الزویر - ساینس دایرکت)

Journal : Microelectronics Reliability, Volume 80, January 2018, Pages 223-229

ترجمه کلمات کلیدی
مدل سازی، اندازه گیری مادون قرمز، شبیه سازی، شبیه سازی مدار،
کلمات کلیدی انگلیسی
Modelling; Infrared measurements; Simulation; Circuit simulation;
پیش نمایش مقاله
پیش نمایش مقاله  شبیه سازی حرارتی غیر خطی در سطح سیستم: مدل سازی فشرده و اعتبار سنجی آزمایشی

چکیده انگلیسی

In this work, a general methodology to extract compact, non-linear transient thermal models of complex thermal systems is presented and validated. The focus of the work is to show a robust method to develop compact and accurate non-linear thermal models in the general case of systems with multiple heat sources. A real example of such a system is manufactured and its thermal behaviour is analyzed by means of Infra-Red thermography measurements. A transient, non-linear Finite-Element-Method based model is therefore built and tuned on the measured thermal responses. From this model, the transient thermal responses of the system are calculated in the locations of interest. From these transient responses, non-linear compact transient thermal models are derived. These models are based on Foster network topology and they can capture the effect of thermal non-linearities present in any real thermal system, accounting for mutual interaction between different power sources. The followed methodology is described, verification of the model against measurements is performed and limitations of the approach are therefore discussed. The developed methodology shows that it is possible to capture strongly non-linear effects in multiple-heat source systems with very good accuracy, enabling fast and accurate thermal simulations in electrical solvers.